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| 74AUP2G07 Low-power dual buffer with open-drain output Rev. 03 -- 16 October 2007 Product data sheet 1. General description The 74AUP2G07 provides two non-inverting buffers with open-drain output. The output of the device is an open drain and can be connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions. Schmitt-trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V. This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2. Features s Wide supply voltage range from 0.8 V to 3.6 V s High noise immunity s Complies with JEDEC standards: x JESD8-12 (0.8 V to 1.3 V) x JESD8-11 (0.9 V to 1.65 V) x JESD8-7 (1.2 V to 1.95 V) x JESD8-5 (1.8 V to 2.7 V) x JESD8-B (2.7 V to 3.6 V) s ESD protection: x HBM JESD22-A114E Class 3A exceeds 5000 V x MM JESD22-A115-A exceeds 200 V x CDM JESD22-C101C exceeds 1000 V s Low static-power consumption; ICC = 0.9 A (maximum) s Latch-up performance exceeds 100 mA per JESD 78 Class II s Inputs accept voltages up to 3.6 V s Low noise overshoot and undershoot < 10 % of VCC s IOFF circuitry provides partial Power-down mode operation s Multiple package options s Specified from -40 C to +85 C and -40 C to +125 C NXP Semiconductors 74AUP2G07 Low-power dual buffer with open-drain output 3. Ordering information Table 1. Ordering information Package Temperature range Name 74AUP2G07GW 74AUP2G07GM 74AUP2G07GF -40 C to +125 C -40 C to +125 C -40 C to +125 C SC-88 XSON6 XSON6 Description plastic surface-mounted package; 6 leads Version SOT363 Type number plastic extremely thin small outline package; no leads; SOT886 6 terminals; body 1 x 1.45 x 0.5 mm plastic extremely thin small outline package; no leads; SOT891 6 terminals; body 1 x 1 x 0.5 mm 4. Marking Table 2. Marking Marking code p7 p7 p7 Type number 74AUP2G07GW 74AUP2G07GM 74AUP2G07GF 5. Functional diagram 1 1A 1Y 6 1A 1 6 1Y Y 3 2A 2Y 4 2A 3 4 2Y A GND mnb092 mnb093 mna625 Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram (one gate) 74AUP2G07_3 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 -- 16 October 2007 2 of 15 NXP Semiconductors 74AUP2G07 Low-power dual buffer with open-drain output 6. Pinning information 6.1 Pinning 74AUP2G07 74AUP2G07 1A GND 1 2 6 5 1Y GND VCC 2A 2A 3 001aad706 1A 1 6 1Y 1A GND 74AUP2G07 1 2 3 6 5 4 1Y VCC 2Y 2 5 VCC 3 4 2Y 2A 4 2Y 001aad707 001aad665 Transparent top view Transparent top view Fig 4. Pin configuration SOT363-1 (SC-88) Fig 5. Pin configuration SOT886 (XSON6) Fig 6. Pin configuration SOT891 (XSON6) 6.2 Pin description Table 3. Symbol 1A GND 2A 2Y VCC 1Y Pin description Pin 1 2 3 4 5 6 Description data input ground (0 V) data input data output supply voltage data output 7. Functional description Table 4. Input nA L H [1] H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF state. Function table[1] Output nY L Z 74AUP2G07_3 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 -- 16 October 2007 3 of 15 NXP Semiconductors 74AUP2G07 Low-power dual buffer with open-drain output 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK VI IOK VO IO ICC IGND Tstg Ptot [1] [2] Parameter supply voltage input clamping current input voltage output clamping current output voltage output current supply current ground current storage temperature total power dissipation Conditions VI < 0 V [1] Min -0.5 -50 -0.5 [1] Max +4.6 +4.6 -50 +4.6 20 50 +150 250 Unit V mA V mA V mA mA mA C mW VO < 0 V Active mode and Power-down mode VO = 0 V to VCC -0.5 -50 -65 Tamb = -40 C to +125 C [2] - The input and output voltage ratings may be exceeded if the input and output current ratings are observed. For SC-88 package: above 87.5 C the value of Ptot derates linearly with 4.0 mW/K. For XSON6 packages: above 45 C the value of Ptot derates linearly with 2.4 mW/K. 9. Recommended operating conditions Table 6. Symbol VCC VI VO Tamb t/V Recommended operating conditions Parameter supply voltage input voltage output voltage ambient temperature input transition rise and fall rate VCC = 0.8 V to 3.6 V Active mode and Power-down mode Conditions Min 0.8 0 0 -40 0 Max 3.6 3.6 3.6 +125 200 Unit V V V C ns/V 74AUP2G07_3 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 -- 16 October 2007 4 of 15 NXP Semiconductors 74AUP2G07 Low-power dual buffer with open-drain output 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Tamb = 25 C VIH HIGH-level input voltage VCC = 0.8 V VCC = 0.9 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V VIL LOW-level input voltage VCC = 0.8 V VCC = 0.9 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 0.8 V to 3.6 V IO = 1.1 mA; VCC = 1.1 V IO = 1.7 mA; VCC = 1.4 V IO = 1.9 mA; VCC = 1.65 V IO = 2.3 mA; VCC = 2.3 V IO = 3.1 mA; VCC = 2.3 V IO = 2.7 mA; VCC = 3.0 V IO = 4.0 mA; VCC = 3.0 V II IOZ IOFF IOFF ICC ICC CI CO VIH input leakage current OFF-state output current power-off leakage current additional power-off leakage current supply current additional supply current input capacitance output capacitance HIGH-level input voltage VI = GND to 3.6 V; VCC = 0 V to 3.6 V VI = VIH; VO = 0 V to 3.6 V; VCC = 0 V to 3.6 V VI or VO = 0 V to 3.6 V; VCC = 0 V VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V VI = VCC - 0.6 V; IO = 0 A; VCC = 3.3 V VCC = 0 V to 3.6 V; VI = GND or VCC VO = GND; VCC = 0 V VCC = 0.8 V VCC = 0.9 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V VIL LOW-level input voltage VCC = 0.8 V VCC = 0.9 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V 0.7 0.9 0.1 0.3 x VCC 0.31 0.31 0.31 0.44 0.31 0.44 0.1 0.1 0.2 0.2 0.5 40 V V V V V V V V A A A A A A pF pF V V V V 0.70 x VCC 0.65 x VCC 1.6 2.0 V V V V Conditions Min Typ Max Unit 0.30 x VCC V 0.35 x VCC V 0.7 0.9 V V Tamb = -40 C to +85 C 0.70 x VCC 0.65 x VCC 1.6 2.0 - 0.30 x VCC V 0.35 x VCC V 0.7 0.9 V V 74AUP2G07_3 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 -- 16 October 2007 5 of 15 NXP Semiconductors 74AUP2G07 Low-power dual buffer with open-drain output Table 7. Static characteristics ...continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter VOL LOW-level output voltage Conditions VI = VIH or VIL IO = 20 A; VCC = 0.8 V to 3.6 V IO = 1.1 mA; VCC = 1.1 V IO = 1.7 mA; VCC = 1.4 V IO = 1.9 mA; VCC = 1.65 V IO = 2.3 mA; VCC = 2.3 V IO = 3.1 mA; VCC = 2.3 V IO = 2.7 mA; VCC = 3.0 V IO = 4.0 mA; VCC = 3.0 V II IOZ IOFF IOFF ICC ICC VIH input leakage current OFF-state output current power-off leakage current additional power-off leakage current supply current additional supply current HIGH-level input voltage VI = GND to 3.6 V; VCC = 0 V to 3.6 V VI = VIH; VO = 0 V to 3.6 V; VCC = 0 V to 3.6 V VI or VO = 0 V to 3.6 V; VCC = 0 V VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V VI = VCC - 0.6 V; IO = 0 A; VCC = 3.3 V VCC = 0.8 V VCC = 0.9 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V VIL LOW-level input voltage VCC = 0.8 V VCC = 0.9 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 0.8 V to 3.6 V IO = 1.1 mA; VCC = 1.1 V IO = 1.7 mA; VCC = 1.4 V IO = 1.9 mA; VCC = 1.65 V IO = 2.3 mA; VCC = 2.3 V IO = 3.1 mA; VCC = 2.3 V IO = 2.7 mA; VCC = 3.0 V IO = 4.0 mA; VCC = 3.0 V II IOZ IOFF input leakage current OFF-state output current power-off leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V VI = VIH; VO = 0 V to 3.6 V; VCC = 0 V to 3.6 V VI or VO = 0 V to 3.6 V; VCC = 0 V 0.11 0.41 0.39 0.36 0.50 0.36 0.50 0.75 0.75 0.75 V V V V V V V A A A 0.33 x VCC V 0.1 0.3 x VCC 0.37 0.35 0.33 0.45 0.33 0.45 0.5 0.5 0.5 0.6 0.9 50 V V V V V V V V A A A A A A V V V V Min Typ Max Unit Tamb = -40 C to +125 C 0.75 x VCC 0.70 x VCC 1.6 2.0 - 0.25 x VCC V 0.30 x VCC V 0.7 0.9 V V 74AUP2G07_3 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 -- 16 October 2007 6 of 15 NXP Semiconductors 74AUP2G07 Low-power dual buffer with open-drain output Table 7. Static characteristics ...continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter IOFF ICC ICC additional power-off leakage current supply current additional supply current Conditions VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V VI = VCC - 0.6 V; IO = 0 A; VCC = 3.3 V Min Typ Max 0.75 1.4 75 Unit A A A 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8. Symbol Parameter Conditions Min CL = 5 pF tpd propagation delay nA to nY; see Figure 7 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V CL = 10 pF tpd propagation delay nA to nY; see Figure 7 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V CL = 15 pF tpd propagation delay nA to nY; see Figure 7 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V [2] [2] [2] 25 C Typ[1] Max -40 C to +125 C Min Max (85 C) Max (125 C) Unit 2.1 1.6 1.6 1.1 1.4 11.6 4.1 3.0 2.7 2.1 2.2 7.5 5.1 4.0 3.2 2.8 1.7 1.3 1.2 0.9 1.1 9.1 6.1 5.0 4.0 3.3 10.0 6.7 5.5 4.4 3.6 ns ns ns ns ns ns 3.0 2.3 2.4 1.7 2.2 14.7 5.1 3.8 3.6 2.8 3.1 9.0 6.1 4.8 3.8 4.2 2.4 2.0 1.8 1.3 1.6 11.2 7.4 6.1 4.8 4.5 12.3 8.1 6.7 5.3 5.0 ns ns ns ns ns ns 3.5 3.0 2.8 2.4 2.2 17.7 6.1 4.5 4.4 3.4 4.0 10.4 6.8 6.7 4.5 5.7 3.2 2.6 2.2 1.9 1.9 13.1 8.6 7.8 5.3 6.1 14.5 9.4 8.6 5.8 6.7 ns ns ns ns ns ns 74AUP2G07_3 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 -- 16 October 2007 7 of 15 NXP Semiconductors 74AUP2G07 Low-power dual buffer with open-drain output Table 8. Dynamic characteristics ...continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8. Symbol Parameter Conditions Min CL = 30 pF tpd propagation delay nA to nY; see Figure 7 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V CL = 5 pF, 10 pF, 15 pF and 30 pF CPD power dissipation capacitance fi = 1 MHz; VI = GND to VCC VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V [1] [2] [3] [4] All typical values are measured at nominal VCC. tpd is the same as tPZL and tPLZ. All specified values are the average typical values over all stated loads. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL x VCC2 x fo) = sum of the outputs. [3][4] [2] 25 C Typ[1] Max -40 C to +125 C Min Max (85 C) Max (125 C) Unit 4.8 4.1 3.8 3.7 3.6 26.7 9.0 6.7 6.8 5.2 6.4 15.6 9.4 9.7 6.7 9.7 4.3 3.7 3.2 3.0 2.8 18.8 11.8 11.0 7.1 10.4 20.7 13.0 12.1 7.8 11.4 ns ns ns ns ns ns - 0.5 0.6 0.6 0.7 0.9 1.2 - - - - pF pF pF pF pF pF 74AUP2G07_3 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 -- 16 October 2007 8 of 15 NXP Semiconductors 74AUP2G07 Low-power dual buffer with open-drain output 12. Waveforms VI nA input GND t PLZ VCC nY output VOL VX mna528 VM VM t PZL VM Measurement points are given in Table 9. Logic level: VOL is the typical output voltage drops that occur with the output load. Fig 7. The data input (nA) to output (nY) propagation delays Table 9. VCC 0.8 V to 1.6 V 1.65 V to 2.7 V 3.0 V to 3.6 V Measurement points Input VM 0.5 x VCC 0.5 x VCC 0.5 x VCC Output VM 0.5 x VCC 0.5 x VCC 0.5 x VCC VX VOL + 0.1 V VOL + 0.15 V VOL + 0.3 V Supply voltage VCC VEXT 5 k G VI VO DUT RT CL RL 001aac521 Test data is given in Table 10. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 8. Load circuitry for switching times Table 10. VCC 0.8 V to 3.6 V Test data Load tr, tf 3 ns CL RL [1] Supply voltage Input VI VCC VEXT tPLH, tPHL open tPZH, tPHZ GND tPZL, tPLZ 2 x VCC 5 pF, 10 pF, 5 k or 1 M 15 pF and 30 pF [1] For measuring enable and disable times RL = 5 k, for measuring propagation delays, set-up and hold times and pulse width RL = 1 M. (c) NXP B.V. 2007. All rights reserved. 74AUP2G07_3 Product data sheet Rev. 03 -- 16 October 2007 9 of 15 NXP Semiconductors 74AUP2G07 Low-power dual buffer with open-drain output 13. Package outline Plastic surface-mounted package; 6 leads SOT363 D B E A X y HE vMA 6 5 4 Q pin 1 index A A1 1 e1 e 2 bp 3 wM B detail X Lp c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT363 REFERENCES IEC JEDEC JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Fig 9. Package outline SOT363 (SC-88) 74AUP2G07_3 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 -- 16 October 2007 10 of 15 NXP Semiconductors 74AUP2G07 Low-power dual buffer with open-drain output XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886 b 1 2 3 4x L1 L (2) e 6 e1 5 e1 4 6x (2) A A1 D E terminal 1 index area 0 DIMENSIONS (mm are the original dimensions) UNIT mm A (1) max 0.5 A1 max 0.04 b 0.25 0.17 D 1.5 1.4 E 1.05 0.95 e 0.6 e1 0.5 L 0.35 0.27 L1 0.40 0.32 1 scale 2 mm Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT886 REFERENCES IEC JEDEC MO-252 JEITA EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22 Fig 10. Package outline SOT886 (XSON6) 74AUP2G07_3 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 -- 16 October 2007 11 of 15 NXP Semiconductors 74AUP2G07 Low-power dual buffer with open-drain output XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm SOT891 1 2 b 3 4x (1) L1 e L 6 e1 5 e1 4 6x (1) A A1 D E terminal 1 index area 0 1 scale DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 max 0.04 b 0.20 0.12 D 1.05 0.95 E 1.05 0.95 e 0.55 e1 0.35 L 0.35 0.27 L1 0.40 0.32 2 mm Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION SOT891 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 05-04-06 07-05-15 Fig 11. Package outline SOT891 (XSON6) 74AUP2G07_3 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 -- 16 October 2007 12 of 15 NXP Semiconductors 74AUP2G07 Low-power dual buffer with open-drain output 14. Abbreviations Table 11. Acronym CDM CMOS DUT ESD HBM MM TTL Abbreviations Description Charged Device Model Complementary Metal Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic 15. Revision history Table 12. Revision history Release date 20071016 Data sheet status Product data sheet Change notice Supersedes 74AUP2G07_2 Document ID 74AUP2G07_3 Modifications: 74AUP2G07_2 Modifications: 74AUP2G07_1 * * * Table 7: Values for CI and CO have changed. Section 11: CPD values have changed. Product data sheet Product data sheet 74AUP2G07_1 Added IOZ in Section 10 and Table 7 20070612 20061121 74AUP2G07_3 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 -- 16 October 2007 13 of 15 NXP Semiconductors 74AUP2G07 Low-power dual buffer with open-drain output 16. Legal information 16.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com 74AUP2G07_3 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 -- 16 October 2007 14 of 15 NXP Semiconductors 74AUP2G07 Low-power dual buffer with open-drain output 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 October 2007 Document identifier: 74AUP2G07_3 |
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